Applications

Thick Film: Quality assurance in hybrid technology

The task
Thick film printing is one of the most important steps in hybrid production. In this process, demand for lower failure rates and higher robustness of the modules has increased tremendously. Therefore, in order to meet present quality standards, highly accurate measurement of production parameters is crucial. These include printed resistor layers, conductor paths and laser trim structures. As of now, measurement with tactile instruments after the baking process is still the most common method to determine these parameters, but it is time-consuming and depends on the operator who has to visually analyze the results.

The solution
The LaserScan and AutoScan provide the operator in production with the ideal tools for thick film measurement. Their innovative sensors and modular software concept allow for fast, automated measurement of film thickness and other production parameters, including freshly printed paste. Thereby fast and precise control of the screen-printing machine is made possible, as for instance by automatically generating an SPC chart.

The Viking desktop tool offers a cost effective solution for mid range accuracy needs.
 

The Viking in the process of measuring thickfilm	The LaserScan measures various parameters such as height, depth, width and angle	Laser trim structures on printed resistor
Automatic generation of an SPC chart with height, width and area		Complex multilayered structures can be precisely measured with the LaserScan

IC Packaging: Process control for semiconductor back-end inspection

The task
Modern IC Packaging such as Chip Scale Package or Flip-Chip advances into new frontiers, with dimensions that become smaller and smaller. This development presents new challenges for production, as warpage and coplanarity problems can occur. The Chip on Board Technology (COB) requires spot checks of fine pitch solder.

The solution
The LaserScan enables manufacturers of IC Packaging modules to analyze warpage, lead coplanarity, laser marking and contact roughness.

Solder paste volume and position can be measured with the AutoScan platform.
 

Measurement of spread, coplanarity and warpage (TSOP- Package)

Automatic volume measurement of fine-pitch solder bumps with LaserScan

Adhesive dots for microwave modules, measured with LaserScan

Tribology: 3D parameters of surfaces

The task
Surface metrology plays a significant role for the interaction and wear of engineering surfaces, where not only profile measurement but also topographical measurement becomes more and more important.

For this purpose, new 3D surface parameters are increasingly used to describe the surface, which presents new challenges for the resolution and speed of metrology systems.

The solution
With the confocal microscope Sensofar topographic 3D measurement
of tribological surfaces has become possible.

Combining these acquisition capabilities with its data analysis software for 3D surface parameters, the Sensofar represents a complete tool for the evaluation of surfaces in tribology. And to make sure that the customerâ??s concerns are continuously addressed, Solarius Development works closely with competent partners in research and production.
The Viking profiler allows for measurement of stress, wear and other form features on both plastic and metal surfaces.
 

Honed grooves in cylinder	Sheet metal after a friction test, 3D measurement with Sensofar	Textured sheet metal surface for the automotive industry, indentations aid in oil absorption
Surface analysis software for calculation of important 3D surface parameters.